Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Abstract: This research examines the integration of free Database Management Systems (DBMSs) with a Spring Bootdriven Inventory Management System. Evaluating MySQL, PostgreSQL, MongoDB, and SQLite, ...
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