Abstract: The millimeter-wave (MMW) 3-D imaging technology with mechanically scanned 1-D nonuniform sparse multiple-input–multiple-output (MIMO) arrays has been extensively researched due to its ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results