Abstract: Ultrasonic wire bonding is one of the critical challenges for power semiconductor manufacturing process, especially for silicon carbide (SiC) power devices. Packaging-related strain on the ...

Engineers can now optimize FDM parts for real applications with reduced trial-and-error testing, allowing manufacturers to ...

Abstract: Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of ...

A new framework, built using Nvidia Omniverse, Microsoft Azure and accelerated Synopsys physics, has already been deployed by ...