Mill-Max introduces low-force spring options for a variety of spring-loaded pins, providing off-the-shelf solutions to satisfy a range of interconnect requirements. These springs are drop-in ...
Abstract: Conventional wire bonding in emerging wide bandgap (WBG) semiconductor devices employed in power modules is subjected to failure due to thermo-mechanical stress occurring at the joints.
Abstract: A novel dual-band patch antenna operating at 28/38 GHz is proposed for multiple-input multiple-output (MIMO) communication systems in this paper. The antenna utilizes substrate integrated ...
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