Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...
In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.
A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...
Hidden semiconductor defects often pass inspection but fail later in operation. Learn how latent defects form, evade ...
This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).
(Nanowerk Spotlight) Scientists have sought to leverage atomic defects to enhance electrocatalytic performance for clean energy applications. However, the inability to precisely study defects' ...
An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...
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