Leading semiconductor makers team up with advanced packaging provider to jointly develop next-generation of eWLB wafer-level packaging technology Geneva, Singapore and Neubiberg, Germany, August ...

Advanced Chip Engineering (ACE), engaged in development of wafer-level packaging technology, noted that its 6-inch products will enter mass production this October. Since last November, it has broken ...

KISSIMMEE, Fla.--(BUSINESS WIRE)--SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Deca Technologies (Deca), a leading provider of advanced electronic interconnect ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results.

As of Monday, January 05, Amkor Technology, Inc.’s AMKR share price has surged by 9.02%, which has investors questioning if ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

MANCHESTER, England, July 9, 2025 /PRNewswire/ -- Smartkem (Nasdaq: SMTK), which is seeking to change the world of electronics with a new class of transistor technology, today announced that it has ...