Incorporating the NanoResolution MRS sensor, the WX3000 Metrology and Inspection systems enable the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced ...
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...
CONCORD, Calif.--(BUSINESS WIRE)--Nordson MARCH, a division of Nordson (NASDAQ:NDSN), a global leader in plasma processing technology, will present the paper, "Plasma Applications for Wafer Level ...
LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...
FREMONT, Calif., Nov. 11, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...
Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
SHANGHAI, April 8, 2021 /PRNewswire/ -- JCET subsidiaries, Jiangyin Changdian Advanced Packaging Co., LTD. (JCAP) and STATS ChipPAC Korea Co., LTD ("SCK") each received the 2020 Supplier Excellence ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
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