Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...

JTEKT Toyoda Americas recently demonstrated a new double-disc horizontal grinder – calling it “an industry first” – that simultaneously grinds both sides of silicon wafers to +/- 1 micron from ...

Taiwan startup Zhi He Technology has developed AI-based AOI (automated optical inspection) equipment that detects defects at diamond grinding wheels aiming to help boost wafer thinning efficiency. Zhi ...

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...

The semiconductor manufacturing process involves many steps, including, but not limited to, film deposition, photolithography, etching, and chemical mechanical polishing (CMP). Contamination can ...

Wafers are transported between stages in the EFEM and cleaning module. In the grinding module, the wafers move from rough grinding to finish grinding as the index table rotates. To improve the ...

Dublin, Dec. 18, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Wafer Polishing & Grinding Equipment Market - Global Forecast 2025-2032" report has been added to ResearchAndMarkets.com's offering. The ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...