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The IoT represents a rapidly growing market for which high-speed wireless connections suitable for various usage systems are indispensable. The arrival of digital transportation is accelerating this ...
Ironwood Electronics has released a new test socket for BGA devices; it features a clamshell lid design for ease of chip replacement in the production environment. Besides final production test, the ...
Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...
Taiwan-based WinWay Technology, a dedicated supplier of IC test interface solutions, has plans to expand production capacity for high-frequency and high-speed IC test sockets in 2021 to meet robust ...
The challenge of SIPs goes beyond what it takes to assemble them. Increasing functionality and performance in ICs have driven manufacturers to work with wider and more challenging packaging solutions.
1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...
GAITHERSBURG, Md., Feb. 26, 2024 (GLOBE NEWSWIRE) -- GL Communications Inc., a global leader in telecom test and measurement solutions, addressed the press regarding their SIP protocol emulation and ...