Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

When looking for ways to save in a medium-sized business–or larger–consider your phone infrastructure. Would a more-nimble SIP-based service trump your traditional setup with VoIP calls? SIP hardware ...

A technical paper titled “Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies” was published by researchers at UCSB, University of California, Santa Barbara.

For many years, System-in-Package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

MUNICH--(BUSINESS WIRE)--Skyworks Solutions, Inc. (Nasdaq: SWKS), and Sequans Communications S.A. (NYSE: SQNS), today introduced the SKY66431, a 5G Massive IoT SiP (system-in-package) solution. This ...

The current trend in the electronics market is to seek solutions with ever-higher levels of integration at an ever lower cost. In this context, the System in Package (SiP) represents the ideal ...