Semiconductor Plating Systems Market to Reach $7.83 Billion by 2030, Dominated by Applied Materials, Solvay, Tokyo Electron

Key market opportunities include the rise of AI-driven manufacturing, growing demand for EVs enhancing use of precise ...
Semiconductor Engineering

MIS Packaging Takes Off

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
조선일보

LG Innotek begins mass production of plating-free smart IC substrate cutting emissions

LG Innotek said on the 10th that it has developed a "next-generation smart integrated circuit (IC) substrate" that boosts performance while cutting carbon emissions to half of previous levels. It is ...
Digi Times

Manz AG develops breakthrough production solution of panel-level packaging to seize growth of automotive semiconductors

Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
Business Wire

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Semiconductor Engineering

Shortages Hit Packaging Biz

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...