Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around ...

Medical packaging sits at the intersection of materials science, sterilization, human factors, and global regulatory ...

Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

RIT’s packaging science program recently received an equipment donation for its Packaging Dynamics Laboratory that will increase its academic and professional training options in safe-guarding shipped ...