AI infrastructure can't evolve as fast as model innovation. Memory architecture is one of the few levers capable of accelerating deployment cycles. Enter SOCAMM2

Micron announces denser and faster GDDR7 memory by talking about how it will transform PC gaming GPUs, ignoring the current memory crisis.

Sandisk (NasdaqGS:SNDK) and SK hynix have agreed to work together to standardize and commercialize High Bandwidth Flash technology. The partnership targets the growing demand from AI inference workloads by adding a new flash based memory layer to existing system architectures.

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data from memory and writing data back to memory. Measured in ...

Samsung ships HBM4 memory at 11.7Gbps speeds and claims an early industry lead

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced the industry’s fastest HBM4 12.8Gbps memory IP solution, which meets the increasingly higher memory bandwidth needs of SoCs targeted for the next generation of AI training and HPC ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data centre scale loads.

Sandisk and SK hynix push High Bandwidth Flash (HBF) standard via OCP to cut AI inference costs and boost scalability.

(CNN) — The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth memory (HBM) technology as well as foreign-produced ones.

On December 2, 2024, the Department of Commerce, Bureau of Industry and Security (BIS) issued a new set of regulations targeting semiconductors manufacturing equipment (SME) and high-bandwidth memory (HBM) chips. The updates are a part of BIS’s ongoing ...