Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...
For decades, the design of leading-edge chips has been a high-wire act—balancing tight deadlines, sophisticated workflows, and the relentless need to consult scattered, often outdated, sources of ...
Texas fabless chip firm Cirrus Logic has announced a new partnership with GlobalFoundries on next-generation bipolar-CMOS-DMOS (BCD) and gallium nitride (GaN) parts.… It says this will be centered ...
“Qi Meng,” the world’s first fully automated AI-based processor chip design system Credit: Screenshot of IThome's article Chinese Academy of Sciences recently introduced “Qi Meng,” the world’s first ...
Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...
Semiconductor chiplets represent an advancement in microchip design. They divide traditional monolithic systems into smaller, modular components. Unlike traditional monolithic SoCs, which integrate ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
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