Failure analysis of ICs requires a quick and proper response because, of course, helping a customer is our main concern. But should we expect the quality assurance (QA) department to test every ...

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology.

The study of drill pipe failure analysis and fatigue testing is critical in understanding the mechanisms behind fracture and degradation in drilling operations. Research in this field integrates ...

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...