Amkor Technology is strengthening its position in advanced chip packaging. Vertiv is capitalizing on soaring demand for liquid cooling and power infrastructure. Both offer investors a unique way to ...

Engineers develop GaN semiconductors, liquid cooling systems and chiplet packaging to handle growing AI power demands in data ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

Taiwan's world-leading microchip manufacturer TSMC says it has started mass producing next-generation "2-nanometer" chips.

To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing systems.

Good morning, good evening. Thank you all for attending the conference call with ASE. I'm Sunny Lin, covering Greater China [ Semis ] at UBS. It's my great honor to host Mr. Yin Chang, Executive VP of ...