Maximilian Holland, research associate, and Marion Früchtl, head of cross competence field, Fraunhofer Institute for Casting, Composite and Processing Technology (IGCV) Figure 1: The design of a ...

The 3D models integrate seamlessly with major BIM platforms and CAD environments, enabling smoother collaboration among stakeholders, especially those working remotely or across locations. This ...

SketchUp has slowly improved the usability and functionality of its iPad application. Recent new updates offer more control over groups and components, more import and export options, more ways to ...

Researchers, including the University of Tennessee, Knoxville’s Belinda Akpa, are using predictive modeling and machine ...

It’s no secret to anyone that chip design gets harder every year. There are two major trends driving these ever-increasing challenges. The first is the continual scaling down to smaller design nodes.