The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...

For the few double-sided PCBs we’ve actually etched at home we simply soldered a piece of wire to either side of a via and clipped off the excess. But if you want to go the extra mile you can’t beat ...